embeddded innovator
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The embedded industry is moving fast. To help you keep up, we're now supplementing Embedded Innovator magazine with three companion newsletters that will be distributed in July, August, and November. Enjoy this first issue!

Rugged applications require careful hardware selection, unique manufacturing and testing methodologies, and robust software design. Developers can address these requirements with minimal cost and effort by leveraging CompactPCI* solutions based on power-efficient Intel® processors.


Innovations in consumer electronics are raising expectations for user interfaces and networking in automation markets. Delivering these innovations while minimizing cost and time to market is a major challenge—one developers can meet with Intel® Atom™ processors and a Sensor and Actor (SAN) Framework based on the developer-friendly Nokia* Qt* software platform.


The new Qseven* computer-on-module (COM) standard is a compelling option for small, fan-less designs. Unlike the other COM standards, Qseven is specifically designed for mobile and battery-operated applications. Additionally, its legacy-free interfaces are an excellent match for the needs of today’s systems, and for the capabilities of the Intel® Atom™ processor.

Hardened COM Express* Type 2 module featuring Intel® Core™2 Duo processor w/ Mobile Intel® GS45 Express chipset & components rated for industrial temp. range from -40 to +85 °C. Up to 8GB DDR3 SO-DIMM, 3x SATA w/ RAID, DirectX 10, GEN4 graphics & I/O incl. 8x USB 2.0.


The CoreModule* 740 is a PC/104-Plus module that continues ADLINK’s commitment to the PC/104 standard. The rugged-by-design CoreModule 740 is based on the Intel® Atom™ processor N450, running at 1.66GHz and combines a wealth of legacy I/O interfaces.


Advanced, reliable & widely-used JTAG debugger provides fast & intuitive debugging on C, C++ level including RTOS awareness for Windows* CE and Linux*. TRACE32* supports multi core applications and helps assure the quality of your Intel® Atom™ processor-based designs.

Find the best solutions from more than 160 Intel® Embedded Alliance members. Speed development, cut costs, and plow through design roadblocks by going to the source.
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