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Deep Packet Inspection (DPI) solutions for LTE must cope with exploding data capacity and increasingly complex packet inspection challenges. This article discusses how the latest Intel® Xeon® processors and specialized packet processing software deliver the necessary performance along with a scalable, flexible solution for the complex workloads involved.


Virtualization can lower bill of materials and operational costs by consolidating multiple applications onto a single hardware platform. To ensure that applications continue to operate as expected in a virtualized environment, however, architects need a platform optimized for virtualization—one that allows assignment of hardware resources to specific operating systems.


To deal with growing traffic, the rise of new applications, and increasing attacks, today’s organizations seek multi-function security solutions that consolidate a full suite of networking and security functions in a single, highly-integrated platform. Here’s how developers can leverage Intel® Virtualization Technology to deliver such a solution.

A fully integrated platform offering state-of-the-art building block options such as 10 GE switch and control modules, dual-core compute, storage, and packet processing modules, media processing, and platform software.


Server-grade performance, energy efficiency & industrial-grade reliability with flexible expansion, graphics, & memory options. Security & management features make SHB108 an ideal choice for medical, military, gaming and factory automation.


LGA1155 Intel® Xeon® E3 & Intel® Core™ i3 processors, USB 3.0, SATA 6Gb/s & Intel® 82579 PHY for high data & video transmission throughput, with Intel® Active Management Technology (Intel® AMT) 7.0 enabling remote problem diagnosis & repair.


A wide variety of rack mount configurations built using powerful Corvalent Industrial Motherboards that remain in production for 7-10 years, and are built to a higher level of quality, durability, and longevity.


Embedded Memory: 8GB Mini-RDIMM DDR3 monolithic module w/ 2Gbit x8 mainstream DRAM components for high density, small size, cost effective solutions in Comms / Networking.

JEDEC standard module mounts in edge connector socket for high performance apps such as ATCA blades, PCIe RAID cards, Switch / Routers.

This edition is sponsored by:
Intel Embedded Alliance
Learn more about the Intel®
Intelligent Systems Alliance



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