embeddded innovator

Until now, image processing in Unmanned Aerial Vehicles (UAVs) required power-hungry DSPs and a dedicated microprocessor. Today, this hardware can be replaced with a single 3rd generation Intel® Core™ processor, minimizing electronics size, weight, power, and cost (SWaP-C). This single processor can even take on flight control, further cutting the bill of materials.

Visual processing applications like industrial inspection and traffic monitoring require high performance in a small thermal footprint – a tough combination to achieve. The 3rd generation Intel® Core™ processor meets this challenge by combining new power-saving features with increased graphics, computing, and I/O throughput.

The use of virtualization in security- and reliability-critical applications like mil/aero has been hindered by the limitations of traditional hypervisors. A new “Type 0″ hypervisor addresses these issues with a minimized architecture that provides a smaller attack surface and more reliable operation. This new architecture also has the flexibility to use any OS as well as bare-metal applications.

Using TRACE32® to debug Intel® Atom™ processor-based designs now gives you the ability to debug your UEFI BIOS of Insyde Software with an intuitive interface, supporting each of its phases, especially within the PEI and DXE phases.

Short-depth, compact embedded server platform based on Mini-ITX X9SPV-F/LN4F supporting mobile 3rd Generation Intel® Core™ processors. The high-performance, low-power server is ideal for storage, network, security, firewall nodes, and other space/power constrained embedded applications.

The NANO-QM770 supports dual-channel DDR3 1600/1333/1066 MHz up to 8 GB. It supports three independent displays with a combination of dual HDMI ports and DVI ports. It also features dual PCIe GbE, 3x COM ports, 4x USB 3.0 ports, 2x SATA 6 Gbps ports, and a Realtek ALC662 HD codec audio connector.

The MB970 is designed for the 22 nm 3rd generation Intel® Core™ processor family that supports three independent displays using the DVI-I, DVI-D, and DisplayPort connectors on board. It features advanced technologies including USB 3.0 and SATA III connectivity to deliver unprecedented performance and speed in any computing environment.

ATP Electronics is a leading manufacturer of high-performance NAND flash memory solutions and DRAM memory modules. ATP products focus on mission critical applications where high levels of technical support, performance consistency, and wide operating temperature ranges are required.

This edition is sponsored by:
Intel Embedded Alliance
Learn more about the Intel®
Intelligent Systems Alliance

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